Adaptive Cooling of Integrated Circuits using Digital Microfluidics
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Author(s): P. Y. Paik, K. Chakrabarty and V. K. Pamula
Publisher: Artech House Books
ISBN: 9781596931381
Format: hardback
203pp
Price: £49.00
Review Date: 13 June 2007
Review: As integrated circuits decrease in size and operating speeds and package densities increase, die temperatures rise, reducing circuit performance and reliability. Hot spots also form due to spatially non-uniform heat fluxes. A number of techniques to address these issues have been proposed, with varying amounts of success. Here an alternative cooling method, based on a recently-invented ‘digital microfluidic’ platform is introduced. This uses a phenomena named electrowetting, which allows a large array of discrete droplets of liquid, ranging in size from microlitres to nanolitres (and potentially to picolitres) to be moved independently along the substrate. This textbook begins with an overview of thermal management issues, gives some examples of methods used for cooling integrated circuits, explains the fundamental principles of how a droplet moves by electrowetting, shows how a basic digital microfluidic platform has been developed towards a cooling platform, and discusses the temperature effects on moving droplets in a digital microfluidic platform The last two chapters investigate two methods of chip cooling using digital microfluidic devices.