Thermal Challenges in Next Generation Electronic Systems. THERMES 2007
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Author(s): S. V. Garimella and A. S. Fleischer (Eds)
Publisher: Millpress Science Publishers
ISBN: 905966051X
Format: hardback + CD-ROM
428pp
Price: €165
Review Date: 07 December 2006
Review: These are the proceedings of a conference to be held in New Mexico in January 2007. As electronic products become smaller and incorporate more and more functionality, volumetric heat generation rates and surface heat fluxes increase. This calls for ultra-compact high heat thermal removal management techniques to be used. Thermal management challenges also arise when electronic systems are subject to harsh environments, large variations in ambient temperature, and external thermal loads. The 48 papers addressing these issues were divided into seven sections: Transport in micro- and nano-thermal systems; Issues in microchannel transport; Advances in liquid cooling; Heat pipe innovations; Thermal challenges and solutions in small form factor electronics; Innovative air cooling techniques; and Advances in system modelling.