Buy a book... 
| Thermal Management of Microelectronic Equipment. Heat Transfer Theory, Analysis Methods, and Design Practices | Buy a book...
|
| Author(s): | L-T Yeh and R. C. Chu |
| Publisher: | American Society of Mechanical Engineers |
| ISBN: | 0791801683 |
| Format: | hardback |
| 414pp | |
| Price: | $95.00 |
| Review Date: | 26 February 2003 |
| Review: | Electronic cooling is of prime importance in enabling technology in the advanced packaging systems and has helped sustain the trends as predicted by ‘Moore’s Law’, It is reported that the max. chip power for high-performance chips will be approaching 300 W in the next decade. Here the authors include both the physics behind, and practical aspects of, thermal management of electronic systems. They begin by looking at heat transfer modes and go on to describe specific subjects that are of practical importance in the design of electronic systems, such as thermal interface resistances, printed circuit boards, air cooling and fans, heat exchangers, and thermoelectric coolers. |