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| Thermal Management of Microelectronic Equipment. Heat Transfer Theory, Analysis Methods, and Design Practice | Buy a book...
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| Author(s): | L-T Yeh and R. C. Chu |
| Publisher: | American Society of Mechanical Engineers |
| ISBN: | 0791801683 |
| Format: | hardback |
| 412pp | |
| Price: | $95.00 |
| Review Date: | 27 September 2002 |
| Review: | It has been well documented that over 50 percent of electronic failures are thermally related so electronic cooling is vitally important in enabling advances in the technology of packaging systems. It is even more important as it is predicted that the maximum power for high-performance chips will approach 300 watts by the next decade. This book provides practical solutions for the everyday cooling problems encountered in electronics, with design data and empirical correlations for use in the analysis and design of electronic equipment. It provides a practical reference for professional engineers as well as graduate and undergraduate students. |