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| Silicon Wafer Bonding Technology for VSLI and MEMS Applications | Buy a book...
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| Author(s): | S. S. Iyer and A. J. Auberton-Hervé (Eds) |
| Publisher: | IEE |
| ISBN: | 0852960395 |
| Format: | hardback |
| 149pp | |
| Price: | £49.00, $79.00 |
| Review Date: | 22 March 2002 |
| Review: | This book gives the essentials of wafer bonding from an engineering perspective. Silicon-on-insulator (SOI) allows for the fabrication of extremely high performance CMOS technology that promises to fuel the engine of bonded wafer growth. Wafer bonding relies on effective interfaces. This book begins with a detailed description of the basic processes of wafer bonding and describes the classical methods of bonding and thinning by mechanical removal such as grinding and polishing. It goes on to discuss the ‘Smart Cut’ method, which combines the bonding principle with a novel wafer splitting method called hydrogen exfoliation. Another method, ‘ELTRAN’, uses a bond and etch-back SOI technique. There are also chapters on wafer characterization and quality assurance and novel applications of bonded wafers. The appendix gives a detailed account of direct silicon-to-silicon bonding. |